Members of Conference Comitteee

The session program of the Technical Conference is planned by the following industry-leading experts.

    < IC & Sensor Packaging Technology EXPO >

  • Shoji Uegaki

    Shoji Uegaki
    Senior Director, Business Development Dept.,
    ASE Group

  • Akio Katsumata

    Akio Katsumata
    Development Engineering Officer,
    J-Devices Corp.

  • Naohiko Hirano

    Naohiko Hirano
    Director,
    Semiconductor Sensor Engineering Div.,
    DENSO Corp.

  • Chiaki Takubo

    Chiaki Takubo
    Senior Fellow, Discrete Semiconductor Div., Storage & Electronic Devices Solutions Co.,
    Toshiba Corp.

  • Osamu Nogimura

    Osamu Nogimura
    President,
    Renesas Semiconductor Package & Test Solutions Co., Ltd.

  • Tsutomu Sekiya

    Tsutomu Sekiya
    General Manager, Tokyo Sales Branch, Sales Div.,
    C. Uyemura & Co., Ltd.

  • Hidenori Onodera

    Hidenori Onodera
    Representative Director,
    Kulicke and Soffa (Japan), Ltd.

  • Sumitoshi Asakuma

    Sumitoshi Asakuma
    Director, Managing Executive Officer, General Manager, Information & Telecommunication Materials Div.,
    Sumitomo Bakelite Co., Ltd.

  • Souichiro Kishimoto

    Souichiro Kishimoto
    Senior Executive Officer, Global Marketing Div. Head, New Business Group Head,
    Dexerials Corp.

  • Chuichi Miyazaki

    Chuichi Miyazaki
    General Manager, Packaging Solution Center, Advanced Performance Materials Operational Headquarters,
    Hitachi Chemical Co., Ltd.

    < INTERNEPCON JAPAN >

  • Tsuyoshi Sato

    Tsuyoshi Sato
    Senior Manager, Electronic Packing & Assembly Technology Research Dept., Corporate Manufacturing Center,
    Toshiba Corp.

  • Yasumitsu Orii

    Yasumitsu Orii
    IMAPS Fellow, General Manager, New Value Creation Office,
    Nagase & Co., Ltd.

  • Kazuto Nishida

    Kazuto Nishida
    Executive, Device Solutions Business Div., Automotive & Industrial Systems Co.,
    Panasonic Corp.

  • Akihiko Miyazawa

    Akihiko Miyazawa
    President and Chief Executive Officer,
    Fujitsu Advanced Technologies Ltd.

    < PWB EXPO >

  • Hiroshi Kondo

    Hiroshi Kondo
    Principal Scientist, Jisso Technology Research Div., Production Engineering Research Lab., Production Engineering Headquarters,
    Canon Inc.

  • Toshihiko Okumura

    Toshihiko Okumura
    Deputy General Manager, Electronics Interconnecting Materials Marketing Dept., Electronics Interconnecting Materials Div., Performance Materials SBU,
    Asahi Kasei Corp.

  • Hiroshi Iinaga

    Hiroshi Iinaga
    General Manager, R&D,
    OKI Circuit Technology Co., Ltd.

  • Koji Ikawa

    Koji Ikawa
    Chief Engineer, Research Engineer, Production Technology Div.,
    CMK Corp.

  • Hirofumi Matsumoto

    Hirofumi Matsumoto
    Fellow/Senior Advisor,
    Nippon Mektron, Ltd.

  • Kiyotaka Komori

    Kiyotaka Komori
    Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co.,
    Panasonic Corp.

  • Takayuki Suzuki

    Takayuki Suzuki
    Manager/PCB Materials, Packaging Materials Business Sector, Advanced Performance Materials Business Headquarters,
    Hitachi Chemical Co., Ltd.

  • Mitsuaki Toda

    Mitsuaki Toda
    Executive Officer, General Manager, Product Development Dept.,
    Meiko Electronics Co., Ltd.

(As of Sep.15, 2017 [Honorifics omitted])