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Dates: Jan. 18 [Wed] - 20 [Fri], 2017
10:00 - 18:00 (Last day until 17:00)Venue: Tokyo Big Sight , Japan Organised by: Reed Exhibitions Japan Ltd.
Covering hot topics including Packaging technology for automotive & wearable applications, Fan-out WLP technologies and Power-electronics, etc.
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Exhibitors will give presentations about the latest products/technologies.
No registration required. Please go to the venue (inside exhibition hall) directly.
Please note that some presentations might be given only in Japanese.
Conference 340 sessions to be held!*Including concurrent conference.
●TEL: 03-5259-9056（Opening Hours：10:00～18:00）