Skip to main content
Dates: Jan. 17 [Wed] - 19 [Fri], 2018
Venue: Tokyo Big Sight, Japan Organised by: Reed Exhibitions Japan Ltd.
Covering hot topics including Packaging technology for automotive & wearable applications, Fan-out WLP technologies and Power-electronics, etc.
Go to TOP
Exhibitors will give presentations about the latest products/technologies.
No registration required. Please go to the venue (inside exhibition hall) directly.
Please note that some presentations might be given only in Japanese.
Conference 340 sessions to be held!*Including concurrent conference.