||Forefront of Advanced Packaging Technologies!|
―3D Packaging, Nano-ink, In-vehicle Electronics, Power Electronics Packaging, etc.
(INJ-K, INJ-S, INJ-1－8)
||Enriched Program Content|
―3D Packaging, In-vehicle, Power Devices, MEMS, Flexible Devices, etc.
(ICP-K, ICP-S1－S2, ICP-1－8)
||Grab the Latest Technologies and Trends|
―EPD, Large Electric PCB, Thermal Design, Printed Electronics, etc.
||Covering Hot Topics!|
―Next-generation Li-ion Battery, Motor & Inverter, ADAS,
(Auto-K, Auto-CNC, Auto1－10)
||The Latest Market Status, Strategies of Key Companies and Leading Edge Technologies of LED, OLED and Next-generation Lightings are Reviewed and Discussed by Significant Speakers.|
(Light-K, Light-1－10, D-S, D-1－17)