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Exhibition Outline

Exhibition Title NEPCON JAPAN
Held within NEPCON JAPAN × ELECTRONIX R&D JAPAN
  - 40th INTERNEPCON JAPAN
  - 28th ELECTROTEST JAPAN
  - 12th IC PACKAGING TECHNOLOGY EXPO
  - ELE TRADE–12th International Electronic Components Trade Show
  - PWB EXPO–12th Printed Wiring Boards Expo
  - MATERIAL JAPAN–2nd Advanced Electronic Materials Expo
  - MicroTech JAPAN–1st Micro Fabrication / Fine Process Technology Expo
Concurrent Shows CAR-ELE JAPAN–3rd Int'l Automotive Electronics Technology Expo
EV JAPAN–2nd EV & HEV Drive System Technology Expo
1st Automotive Lightening Technology Expo
LIGHTING JAPAN–3rd LED/OLED Lighting Technology Expo
Dates January 19 (Wed) - 21 (Fri), 2011
Venue Tokyo Big Sight, Tokyo, Japan
Concurrent Events INTERNEPCON / ELECTROTEST
IC PACKAGING TECHNOLOGY EXPO
PWB EXPO
CAR-ELE JAPAN / EV JAPAN
LIGHTING JAPAN
Technical Conference
Organised by Reed Exhibitions Japan Ltd.
Services included in
the exhibit price
  • Exhibit Raw Space (excluding display system cost such as the walls, carpet, etc.)
  • Free Invitation Tickets
  • Special VIP Customers Invitation System
  • Free promotion of exhibition by press released to industry's prominent publication / magazines
  • Publishing of your exhibiting information on official website
  • Publishing of your company name & exhibiting information in "Floor Plan" & "Official Web Directory" which are distributed to all visitors

*Other services to increase your exhibiting effect are also available.
Visitor Profile Experts & professionals involved in the wide range of fields related to Electronics Manufacturing
  • Home Appliances
  • Personal Computer Peripheral / Office Equipment
  • Audio / Visual Equipment
  • Test / Inspection Equipment
  • Aircraft / Vessel Equipment
  • Optical Instrument
  • Mobile Communication Systems Equipment
  • Semiconductor Assembly
  • Industrial Control / Factory Automation
  • Transportation Equipment
  • Medical Device and Others  etc.
Exhibit Profile INTERNEPCON JAPAN
ASIA'S LARGEST Exhibition featuring all kinds of Equipment, Materials and Technologies for Electronics Manufacturing and SMT
ELECTROTEST JAPAN
Exhibition featuring all kinds of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing
IC PACKAGING TECHNOLOGY EXPO
Specialised in Packaging Technologies for Semiconductors, LED, MEMS, Sensors
ELE TRADE–International Electronic Components Trade Show
Japan's Most Powerful Exhibition for all kinds of Electronic Components and Devices
<Consumer Electronics> <Industrial Electronics> <Communication Equipment>
PWB EXPO–Printed Wiring Boards Expo
Exhibition featuring PCBs/PWBs, PCB Materials, Design & Development Services, Design Tools
MATERIAL JAPAN–Advanced Electronic Materials Expo
Exhibition featuring Electronic Materials and Technologies
MicroTech JAPAN–Micro Fabrication / Fine Process Technology Expo
Exhibition specialised in all kinds of Processing Technologies for Electronics Manufacturing
CAR-ELE JAPAN–Int'l Automotive Electronics Technology Expo
International exhibition specialised in all kinds of in-vehicle systems, components, materials and manufacturing equipment related to automotive electronics
EV JAPAN–EV & HEV Drive System Technology Expo
Gathering Motors, Inverters and Rechargeable Batteries for EV & HEV!
Automotive Lightening Technology Expo
Tradeshow featuring all kinds of Devices, Materials and Processing Technologies for Automotive Lightening
LIGHTING JAPAN–LED/OLED Lighting Technology Expo
International Show for LED/OLED Lighting Technology
Contact Us NEPCON JAPAN Show Management
Attn: Hajime Suzuki (Mr.), Kanako Otsuka (Ms.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502  FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp
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