>> Full Program
[INJ-4] Leading-edge Technology for Further-evolving
Printed Electronics
[INJ-6] Current Market and Technical Trends of
Touch Panels with Rapidly-growing Applications
[PWB-6] Latest
FPC
Market and Technology Trends
[PWB-7]
Ultrafine Processing Technology
at the Forefront
[ICP-2] Latest Trends of
Semiconductor Manufacturers Worldwide
[ICP-8] Cutting Edge of
MEMS Technology
–Practical Applications and Technical Challenges–
[ICP-9] Future of
Automotive Electronics & IC Packaging Technology
[ICP-10] Most-current Development Trends in
Power Devices for Power Saving
[INJ-6] Current Market and Technical Trends of
Touch Panels with
Rapidly-growing Applications
[INJ-9] Striking Progress of
Smart Phone Mounting
Technology
[PWB-1]
High-thermal Conductivity Resin Substrates
with Growing Attention from
Automotive and Smartphone Applications
[PWB-8] Technical Solutions to Achieve
Thinner Mobile Devices
[ICP-1] IC Packaging Roadmaps for
Smaller and Thinner Package with Higher Function
[ICP-3]
Smartphones, Tablets & Ultra-books
-Most-advanced Packaging Technology-
[INJ-1] Development of
Pb-free Soldering
Options and Reliability
[INJ-5]
Nanoparticle Manufacturing
and
Fine-pitch Mounting
Technologies
[PWB-4]
Advanced PCB Materials
Pioneer the Future
–Cutting-edge Technology Development–
[PWB-5] New Technology and Materials for Buildup
PCB for Smartphones and Tablets
[ICP-6] Latest Material Technology for
Advanced IC Packaging
[INJ-1] Development of
Pb-free Soldering
Options and Reliability
[INJ-2] Latest Trends of
Micro-bump
and
Interconnection Technologies
[INJ-3]
High-quality Production System
in Mounting Process and Recent Updates on
Advanced Testing & Analysis Technology
[INJ-5]
Nanoparticle Manufacturing
and
Fine-pitch Mounting
Technologies
[INJ-7] Perspectives and Challenges of
Automotive Electronic Mounting
[INJ-8] Forefront of
Power Device Mounting
and
Heat Radiation Technologies
[INJ-9] Striking Progress of
Smart Phone Mounting
Technology
[INJ-10]
LED Device Mounting
Technology and its Development Trends
[PWB-1]
High-thermal Conductivity Resin Substrates
with Growing Attention from
Automotive and Smartphone Applications
[PWB-2] Latest Technology Trends in
LED Heat Radiation Design and Materials
[PWB-3] Front-line Technology of Further Developing
Printed Electronics
[PWB-6] Latest
FPC
Market and Technology Trends
[PWB-7]
Ultrafine Processing Technology
at the Forefront
[PWB-9]
Next-generation PCB
and
Interposer
–Possibility of
LSI Global Interconnects
–
[PWB-10] Universal Prevalence of
Built-in Technology
–Industry Trends and Simulation & Component Technology–
[ICP-1] IC Packaging Roadmaps for
Smaller and Thinner Package with Higher Function
[ICP-4] Evolving
3D Packaging
Innovates Devices and the World
[ICP-5] Keys to Cost Reduction –Recent
Copper Wirebonding Technology
–
[ICP-7] Recent Status of
LED Mounting
Technology and Sealing Materials
[ICP-8] Cutting Edge of
MEMS
Technology
–Practical Applications and Technical Challenges–
[ICP-9] Future of
Automotive Electronics & IC Packaging
Technology
[ICP-10] Most-current Development Trends in
Power Devices
for Power Saving
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