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Latest technologies and industry trends will be addressed; from Lead-free Soldering, Micro Joint, Cutting-edge Testing Technologies, to Applications to the hottest fields such as Smartphones, Power Modules, etc.
(INJ-K, INJ-1–INJ-10) |
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3 Dimensional Assembly, TSV, Copper Wire, In-vehicle Semiconductors, Power Devices, etc., the latest technology trends of IC Packaging.
(ICP-K, ICP-1–ICP-10, ICP-S1, S2, S3) |
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Device Embedded Substrates, Printed Electronics, Heat-resistant Technologies, FPC etc., the latest technologies and industry trends of PCBs.
(PWB-K, PWB-1–PWB-10) |
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EV/HEV, Motors, Secondary Batteries, Safety Technologies, the Key to Grab the Emerging Markets, etc., hottest topics in the industry.
(CAR-K, CAR-1–CAR-10) |
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Industry trends, Strategies of leading companies, Element technologies, etc., various approaches to LED & OLED Lighting.
(LIGHT-K, LIGHT-1–LIGHT-15) |