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Forefront of Advanced Packaging Technologies! Pb-free soldering, 3D packaging and Packaging Technologies for Smartphones and Power Modules.
(INJ-K, INJ-1–INJ-10) |
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Discover the Future Perspective and Environmental Change of the Semiconductor Industry ―3D Packaging, In-vehicle, Power Devices, etc.
(ICP-K, ICP-1–ICP-10) |
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Grab the Latest Technologies and Trends ―EPD, Printed Electronics, FPC, Thermal Design, etc.
(PWB-K, PWB-1–PWB-10) |
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Covering hot topics! EV/PHV, Motors, Rechargeable Batteries, Next-generation Telematics, etc.
Auto-K1/K2, Auto-1–Auto-10, Auto-IT1–Auto-IT3) |
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The Latest Market Status, Strategies of Key Companies and Leading Edge Technologies of LED, OLED and Next-generation Lightings are reviewed and discussed by Significant Speakers.
(Light-K, Light-1–Light-10, Light-S1/S2, D-1–D-10) |