• NEPCON JAPAN이란?

    일렉트로닉 설계, R&D, 제조 기술을 위한 아시아 최대급 전시회

    NEPCON JAPAN은 1972년 개최이래, 일본 및 아시아 전자 산업과 함께 성장해 왔습니다. 일렉트로닉스 제조 및 R&D에 필수적인 7개의 핵심 분야로 구성된 본 전시회는 일렉트로닉 업계 전문가를 위한 아시아를 대표하는 원스톱의 장으로서 가치가 더욱 증대되었습니다.
    또한, '자동차', '웨어러블 디바이스', '로봇', '스마트 팩토리'와 같은 유망 분야 전시회를 동시 개최함으로써, NEPCON JAPAN은 '전자기술의 미래'를 전시하는 최신 기술이 집결되는 장으로 더욱 주목받고 있는 전시회입니다.

  • 컨퍼런스 자문위원 멤버 위원 목록 >

    The session program of the Technical Conference was planned by the following industry-leading experts.

    < IC Packaging Technology Expo >

    Akito Yoshida

    Akito Yoshida

    Chief Technology Officer, Development Engineering Officer,
    Amkor Technology, Inc. – J-Devices Corp.

    Shoji Uegaki

    Shoji Uegaki

    Senior Director, Business Development Dept.,
    ASE Group

    Akio Katsumata

    Akio Katsumata

    PLP Business Promotion Officer,
    J-Devices Corp.

    Naohiko Hirano

    Naohiko Hirano

    Director, Semiconductor Packaging R&D Div.,
    DENSO Corp.

    Chiaki Takubo

    Chiaki Takubo

    Senior Manager, Backend Device Technology Dept., Center for Semiconductor Research & Development,
    Semiconductor & Storage Products Co.,
    Toshiba Corp.

    Osamu Nogimura

    Osamu Nogimura

    President,
    Renesas Semiconductor Package & Test Solutions Co., Ltd.

    Tsutomu Sekiya

    Tsutomu Sekiya

    General Manager, Tokyo Sales Branch, Sales Div.,
    C. Uyemura & Co., Ltd.

    Hidenori Onodera

    Hidenori Onodera

    Representative Director,
    Kulicke and Soffa (Japan), Ltd.

    Sumitoshi Asakuma

    Sumitoshi Asakuma

    Director, Managing Executive Officer, General Manager, Information & Telecommunication Materials Div.,
    Sumitomo Bakelite Co., Ltd.

    Souichiro Kishimoto

    Souichiro Kishimoto

    Senior Executive Officer, Global Marketing Div. Head, New Business Group Head,
    Dexerials Corp.

    Chuichi Miyazaki

    Chuichi Miyazaki

    General Manager, Packaging Solution Center, Advanced Performance Materials Operational Headquarters,
    Hitachi Chemical Co., Ltd.

    < INTERNEPCON JAPAN >

    Tsuyoshi Sato

    Tsuyoshi Sato

    Senior Manager, Electronic Packing & Assembly Technology Research Dept., Corporate Manufacturing Center,
    Toshiba Corp.

    Yasumitsu Orii

    Yasumitsu Orii

    Technical Advisor, IMAPS Fellow,
    Nagase & Co., Ltd.

    Kazuto Nishida

    Kazuto Nishida

    Director, Production Engineering Lab.,
    Production Engineering Div.,
    Panasonic Corp.

    Akihiko Miyazawa

    Akihiko Miyazawa

    President and Chief Executive Officer,
    Fujitsu Advanced Technologies Ltd.

    < PWB Expo >

    Hiroshi Kondo

    Hiroshi Kondo

    Manager, Jisso Technology Research Dept. 1, Production Engineering Research Lab., Production Engineering Headquarters,
    Canon Inc.

    Takaaki Domon

    Takaaki Domon

    Technical Adviser, Monozukuri Center Manufacturing HQ,
    TDK Corp.

    Toshihiko Okumura

    Toshihiko Okumura

    Deputy General Manager, Electronics Interconnecting Materials Marketing Dept., Electronics Interconnecting Materials Div., Performance Materials SBU,
    Asahi Kasei Corp.

    Hiroshi Iinaga

    Hiroshi Iinaga

    General Manager, R&D,
    OKI Circuit Technology Co., Ltd.

    Toshihiro Chiba

    Toshihiro Chiba

    General Manager, Engineering and Quality Assurance, Iwate Plant,
    Daisho Denshi Co., Ltd.

    Koji Ikawa

    Koji Ikawa

    Chief Engineer, Research Engineer, Production Technology Div.,
    CMK Corp.

    Hirofumi Matsumoto

    Hirofumi Matsumoto

    Fellow/Senior Adviser,
    Nippon Mektron, Ltd.

    Kiyotaka Komori

    Kiyotaka Komori

    Manager, Product Development Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co.,
    Panasonic Corp.

    Kenichi Ikeda

    Kenichi Ikeda

    Manager, Laminates & Materials Business Unit, Advanced Performance Materials Business Headquarters,
    Hitachi Chemical Co., Ltd.

    Mitsuaki Toda

    Mitsuaki Toda

    Executive Officer, General Manager, Product Development Dept.,
    Meiko Electronics Co., Ltd

    (경칭 생략, 무순 2016년 8월 30일 현재)