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  • 什么是NEPCON JAPAN?

    亚洲领先的电子设计、研发与制造技术展览会。

    作为“电子封装&制造”的综合展会,自1972年举办至今,NEPCON JAPAN随着日本电子行业的发展也在不断的成长壮大。在2000年,本展会增设了IC封装技术、印制电路板以及电子元件的展览部分,进一步提高了展会的价值,使之成为“电子研发、设计以及制造等领域的国际性综合展览会”。近年,在此规模基础上又新增了关于汽车电子、电动汽车、LED/OLED照明技术以及可穿戴式电子产品等拥有良好发展前景的同期展会。NEPCON JAPAN作为了解“未来电子产业”最新技术的绝佳场所而备受业界瞩目。最近几年,来自中国、韩国、台湾的参展商以及观展人士不断增加,NEPCON JAPAN已经成为了名副其实的“代表亚洲电子产业”的综合性展览会。

  • 高峰论坛组委会成员名单 查看所有成员名单 >

    技术研讨会受到了以下业界知名企业领导、专家们的鼎力支持。

    < IC Packaging Technology Expo >

    Akito Yoshida

    Akito Yoshida

    Chief Technology Officer, Development Engineering Officer,
    Amkor Technology, Inc. – J-Devices Corp.

    Shoji Uegaki

    Shoji Uegaki

    Senior Director, Business Development Dept.,
    ASE Group

    Akio Katsumata

    Akio Katsumata

    PLP Business Promotion Officer,
    J-Devices Corp.

    Naohiko Hirano

    Naohiko Hirano

    Director, Semiconductor Packaging R&D Div.,
    DENSO Corp.

    Chiaki Takubo

    Chiaki Takubo

    Senior Manager, Backend Device Technology Dept., Center for Semiconductor Research & Development,
    Semiconductor & Storage Products Co.,
    Toshiba Corp.

    Osamu Nogimura

    Osamu Nogimura

    President,
    Renesas Semiconductor Package & Test Solutions Co., Ltd.

    Tsutomu Sekiya

    Tsutomu Sekiya

    General Manager, Tokyo Sales Branch, Sales Div.,
    C. Uyemura & Co., Ltd.

    Hidenori Onodera

    Hidenori Onodera

    Representative Director,
    Kulicke and Soffa (Japan), Ltd.

    Sumitoshi Asakuma

    Sumitoshi Asakuma

    Director, Managing Executive Officer, General Manager, Information & Telecommunication Materials Div.,
    Sumitomo Bakelite Co., Ltd.

    Souichiro Kishimoto

    Souichiro Kishimoto

    Senior Executive Officer, Global Marketing Div. Head, New Business Group Head,
    Dexerials Corp.

    Chuichi Miyazaki

    Chuichi Miyazaki

    General Manager, Packaging Solution Center, Advanced Performance Materials Operational Headquarters,
    Hitachi Chemical Co., Ltd.

    < INTERNEPCON JAPAN >

    Tsuyoshi Sato

    Tsuyoshi Sato

    Senior Manager, Electronic Packing & Assembly Technology Research Dept., Corporate Manufacturing Center,
    Toshiba Corp.

    Yasumitsu Orii

    Yasumitsu Orii

    Technical Advisor, IMAPS Fellow,
    Nagase & Co., Ltd.

    Kazuto Nishida

    Kazuto Nishida

    Director, Production Engineering Lab.,
    Production Engineering Div.,
    Panasonic Corp.

    Akihiko Miyazawa

    Akihiko Miyazawa

    President and Chief Executive Officer,
    Fujitsu Advanced Technologies Ltd.

    < PWB Expo >

    Hiroshi Kondo

    Hiroshi Kondo

    Manager, Jisso Technology Research Dept. 1, Production Engineering Research Lab., Production Engineering Headquarters,
    Canon Inc.

    Takaaki Domon

    Takaaki Domon

    Technical Adviser, Monozukuri Center Manufacturing HQ,
    TDK Corp.

    Toshihiko Okumura

    Toshihiko Okumura

    Deputy General Manager, Electronics Interconnecting Materials Marketing Dept., Electronics Interconnecting Materials Div., Performance Materials SBU,
    Asahi Kasei Corp.

    Hiroshi Iinaga

    Hiroshi Iinaga

    General Manager, R&D,
    OKI Circuit Technology Co., Ltd.

    Toshihiro Chiba

    Toshihiro Chiba

    General Manager, Engineering and Quality Assurance, Iwate Plant,
    Daisho Denshi Co., Ltd.

    Koji Ikawa

    Koji Ikawa

    Chief Engineer, Research Engineer, Production Technology Div.,
    CMK Corp.

    Hirofumi Matsumoto

    Hirofumi Matsumoto

    Fellow/Senior Adviser,
    Nippon Mektron, Ltd.

    Kiyotaka Komori

    Kiyotaka Komori

    Manager, Product Development Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co.,
    Panasonic Corp.

    Kenichi Ikeda

    Kenichi Ikeda

    Manager, Laminates & Materials Business Unit, Advanced Performance Materials Business Headquarters,
    Hitachi Chemical Co., Ltd.

    Mitsuaki Toda

    Mitsuaki Toda

    Executive Officer, General Manager, Product Development Dept.,
    Meiko Electronics Co., Ltd

    (截至2016年8月30日 [任意排序‧省略敬称])

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    NEPCON JAPAN 展会事务局
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