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  • NEPCON 将首次亮相名古屋!
    NEPCON将改为每年举办两次
    日期: 2018年9月5日-7日会场: 日本名古屋Portmesse展览中心 >>>更多详情

  • 什么是NEPCON JAPAN?

    亚洲领先的电子设计、研发与制造技术展览会。

    作为“电子封装&制造”的综合展会,自1972年举办至今,NEPCON JAPAN随着日本电子行业的发展也在不断的成长壮大。在2000年,本展会增设了IC封装技术、印制电路板以及电子元件的展览部分,进一步提高了展会的价值,使之成为“电子研发、设计以及制造等领域的国际性综合展览会”。近年,在此规模基础上又新增了关于汽车电子、电动汽车、LED/OLED照明技术以及可穿戴式电子产品等拥有良好发展前景的同期展会。NEPCON JAPAN作为了解“未来电子产业”最新技术的绝佳场所而备受业界瞩目。最近几年,来自中国、韩国、台湾的参展商以及观展人士不断增加,NEPCON JAPAN已经成为了名副其实的“代表亚洲电子产业”的综合性展览会。

  • 高峰论坛组委会成员名单 (2018)查看所有成员名单 >

    技术研讨会受到了以下业界知名企业领导、专家们的鼎力支持。

    < IC & Sensor Packaging Technology EXPO >

    Shoji Uegaki

    Shoji Uegaki

    Senior Director, Business Development Dept.,
    ASE Group

    Akio Katsumata

    Akio Katsumata

    Development Engineering Officer,
    J-Devices Corp.

    Naohiko Hirano

    Naohiko Hirano

    Director, Semiconductor Sensor Engineering Div.,
    DENSO Corp.

    Chiaki Takubo

    Chiaki Takubo

    Senior Fellow, Discrete Semiconductor Div., Storage & Electronic Devices Solutions Co.,
    Toshiba Corp.

    Osamu Nogimura

    Osamu Nogimura

    President,
    Renesas Semiconductor Package & Test Solutions Co., Ltd.

    Tsutomu Sekiya

    Tsutomu Sekiya

    General Manager, Tokyo Sales Branch, Sales Div.,
    C. Uyemura & Co., Ltd.

    Hidenori Onodera

    Hidenori Onodera

    Representative Director,
    Kulicke and Soffa (Japan), Ltd.

    Sumitoshi Asakuma

    Sumitoshi Asakuma

    Director, Managing Executive Officer,
    Sumitomo Bakelite Co., Ltd.

    Souichiro Kishimoto

    Souichiro Kishimoto

    Senior Executive Officer, Global Marketing Div. Head, New Business Group Head,
    Dexerials Corp.

    Chuichi Miyazaki

    Chuichi Miyazaki

    General Manager, Packaging Solution Center, Advanced Performance Materials Operational Headquarters,
    Hitachi Chemical Co., Ltd.

    < INTERNEPCON JAPAN >

    Tsuyoshi Sato

    Tsuyoshi Sato

    Senior Manager, Electronic Packing & Assembly Technology Research Dept., Corporate Manufacturing Center,
    Toshiba Corp.

    Yasumitsu Orii

    Yasumitsu Orii

    IMAPS Fellow, General Manager, New Value Creation Office,
    Nagase & Co., Ltd.

    Kazuto Nishida

    Kazuto Nishida

    Executive, Device Solutions Business Div.,
    Panasonic Corp.

    Akihiko Miyazawa

    Akihiko Miyazawa

    President and Chief Executive Officer,
    Fujitsu Advanced Technologies Ltd.

    < PWB EXPO >

    Hiroshi Kondo

    Hiroshi Kondo

    Principal Scientist, Jisso Technology Research Div., Production Engineering Research Lab., Production Engineering Headquarters,
    Canon Inc.

    Toshihiko Okumura

    Toshihiko Okumura

    Deputy General Manager, Electronics Interconnecting Materials Marketing Dept., Electronics Interconnecting Materials Div., Performance Materials SBU,
    Asahi Kasei Corp.

    Hiroshi Iinaga

    Hiroshi Iinaga

    General Manager, R&D,
    OKI Circuit Technology Co., Ltd.

    Koji Ikawa

    Koji Ikawa

    Chief Engineer, Research Engineer, Production Technology Div.,
    CMK Corp.

    Hirofumi Matsumoto

    Hirofumi Matsumoto

    Fellow/Senior Advisor,
    Nippon Mektron, Ltd.

    Kiyotaka Komori

    Kiyotaka Komori

    Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co.,
    Panasonic Corp.

    Takayuki Suzuki

    Takayuki Suzuki

    Manager/PCB Materials, Packaging Materials Business Sector, Advanced Performance Materials Business Headquarters,
    Hitachi Chemical Co., Ltd.

    Mitsuaki Toda

    Mitsuaki Toda

    Executive Officer, General Manager, Product Development Dept.,
    Meiko Electronics Co., Ltd.

    (截至2017年9月15日 [任意排序‧省略敬称])

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