Nepcon Japan 2023

Launched more than 30 years ago, NEPCON JAPAN has grown together with the Japanese & Asian electronics industry.

Consisting of 6 shows specialised in essential areas for electronics manufacturing and R&D, the show has increased its value as an exhibition representing Asia's leading one-stop venue for all those involved in electronics industry.

If you are looking for the technologies/products related to SMT, electronics testing, IC&sensor packaging, electroics components/materials, pricted circuit boards, 5G, or fine process technologies, visit & discover the latest technolgies gathered from all over the world!

1,420

Exhibitors

70,000

Visitors

170

Speakers

You Can Discover All the Electronics Technologies

NEPCON JAPAN consists of the following 6 areas specialising in significant sectors in the electronics industry.

INTERNEPCON JAPAN

ELECTROTEST JAPAN

IC & SENSOR PACKAGING EXPO

ELECTRONICS COMPONENTS & MATERIALS EXPO

PWB EXPO

FINE PROCESS TECHNOLOGY EXPO

You Can Also Learn the Electronics Industry's Latest Trends at Co-held Conference

Speakers

UCIe™: Building an Open Ecosystem of Chiplets for On-package Innovations

Cheolmin Park

President, UCIe Consortium/Corporate VP and head of New Business Planning team at Memory Div.,

Samsung

Possibilites of Imaging & Sensing Technology and the Future Envisioned with Sense the Wonder

Terushi Shimizu

Representative Director, President and CEO,

Sony Semiconductor Solutions Corp.

Heterogeneous Integration in Package - Applications Driving Material and Process Diversity

Thorsten Meyer

Senior Principal,
Package Concept Egineering,

Infineon Technologies AG

Semiconductor Package Substrate Development Trends Driving Heterogeneous Integration

Kiyoshi Oi

Senior Manager,
Process Development Dept., RESEARCH & DEVELOPMENT Div.,

SHINKO ELECTRIC INDUSTRIES Co., Ltd.

Substrate Solution Technology Delivering High-speed and High-performance for 3D Packaging

Yoshikazu Uehara

Dept. Manager, Board Solution and Development Dept., Engineering and Development Div., Corporate. Organic Materials Semiconductor Components Group.

KYOCERA Corp.

Speakers of Co-held Conference

Toward Achieving Carbon Neutrality in 2050

Hirofumi Inoue

President, Advanced R&D and Engineering Company,
Senior General Manager, Technical Project Field, Vehicle Technology Field,

Toyota Motor Corp.

JAL Air Mobility Business as ESG Strategy

Hitoshi Murakoshi

Vice President, Air Mobility Business Creation Dept., Digital Innovation Div.,

Japan Airlines Co., Ltd.

Initiatives for Honda Solution System "AWV Case Study"

Tustomu Wakitani

Vice President, Executive Chief Engineer, Solution System, R&D Business Unit,

American Honda Motor Co., Inc.

Asia's Leading - 1,420 Exhibitors Gather