Launched more than 30 years ago, NEPCON JAPAN has grown together with the Japanese & Asian electronics industries. The show specialised in essential areas for electronics manufacturing and R&D, and increased its value as an exhibition representing Asia's leading one-stop venue for all those involved in the electronics industry.
NEPCON JAPAN Post Show Report
Post Show Report
Date: January 24-26, 2024
Venue: Tokyo Big Sight, Japan
ABOUT
NEPCON JAPAN
No. of Visitors
Including Concurrent Shows:
77,744
Visitors
No. of Conference Sessions
No. of Conference Sessions
Including Concurrent Shows:
170
Speakers
Exhibitors Gathered from 25 Countries/Regions
Exhibitors Gathered
from 25
Countries/Regions
Australia
Austria
Canada
China
Finland
France
Germany
Hong Kong
India
Israel
Italy
Japan
Madagascar
Mexico
Netherlands
Norway
Philippines
Poland
Singapore
South Korea
Sweden
Switzerland
Taiwan
United Kingdom
United States
Visitors gathered from 58 countries/regions.
Visitors gathered from
58 countries/regions.
- Australia
- Austria
- Belgium
- Brazil
- Bulgaria
- Canada
- Chile
- China
- Cyprus
- Czechia
- Denmark
- Finland
- France
- Germany
- Heard Island And Mcdonald Islands
- Hong Kong
- Hungary
- India
- Indonesia
- Iran
- Iraq
- Ireland
- Israel
- Italy
- Japan
- Kazakhstan
- Korea
- Kuwait
- Lithuania
- Malaysia
- Mexico
- Mongolia
- Mozambique
- Namibia
- Netherlands
- New Zealand
- Pakistan
- Panama
- Philippines
- Poland
- Romania
- Singapore
- Slovenia
- South Africa
- Spain
- Sri Lanka
- Sweden
- Switzerland
- Taiwan
- Tanzania
- Thailand
- Tunisia
- Türkiye
- United Arab Emirates
- United Kingdom
- United States
- Uzbekistan
- Viet Nam
Conference Speakers (excerpts)
Keynote Session
TSMC's Strategies towards Global Manufacturing and Next-generation Technologies
Long Song Lin
Senior Director, System Customer Strategy,
Taiwan Semiconductor Manufacturing Co., Ltd.
Resonac's Strategy for Co-creation in the Semiconductor Industry
Hidenori Abe
Executive Officer, Deputy General Manager, Electronics Business Headquarters
Resonac Corp.
Special & Technical Sessions
Latest Technological Trends in Electrified Products for the Full-scale Spread of xEVs
Natsuki Nozawa
General Manager, Electrification Components Div.,
DENSO Corp.
Current Status and Future Trends of Power Semiconductor Modules
Toru Hosen
Director, Senior Managing Executive Officer and Corporate General Manager of the Semiconductors Business Group,
Fuji Electric Co., Ltd.
Next-generation Semiconductors for Industrial Applications to Realize Decarbonization
Ikuya Kawasaki
President,
Infineon Technologies Japan K.K.
Yaskawa's Initiatives on Power Conversion Technologies toward the Realization of Carbon Neutral
Tatsuya Yamada
Senior Executive Officer, General Manager, Drives Div.,
Yaskawa Electric Corp.
AIST's R&D of 3DIC Technology in National Projects
Katsuya Kikuchi
Research Team Leader, 3D Integration Technology Research Team, Advanced Semiconductor Research Center
National Institute of Advanced Industrial Science and Technology (AIST)
2.5D/3D Advanced Package Platform Guide
TaeKyeong Hwang
R&D, VP,
Amkor Technology Inc.
Advanced Package for AI
Daniel Ng
Advanced Technology, PMTS Packaging Engineering,
Advanced Micro Devices, Inc.
Development of 2.3D Large Package with Panel Level Technology for HPC/AI
Lee Jeongho
Products Development Team, Project Leader, (Principle Engineer),
Samsung Electronics Co., Ltd.
East Halls
Exhibitions held inside East Halls
・NEPCON JAPAN 2024
・16th AUTOMOTIVE WORLD 2024
West Halls
Exhibitions held inside West Halls
・10th WEARABLE EXPO
・FACTORY INNOVATION Week Tokyo 2024
・3rd SMART LOGISTICS Expo
