TOP > About > Exhibit Profile / Area > IC & SENSOR PACKAGING TECHNOLOGY EXPO
Dates: January 19 (Wed) - 21 (Fri), 2022
Venue: Tokyo Big Sight, Japan
Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services
Members of Conference Committee
The session program of the Technical Conference is planned by the following industry-leading experts.
(As of Oct. 19th, 2021 [Honorifics omitted])
< IC & SENSOR PACKAGING TECHNOLOGY EXPO >
If you have queries, please do not hesitate to contact us.
Organiser: RX Japan Ltd.
(Formerly Reed Exhibitions Japan Ltd.)
NEPCON JAPAN Show Management
TEL : +81-3-3349-8502
FAX : +81-3-3349-4900
E-mail :
For Exhibiting>>
inw.jp@rxglobal.com
For Visiting>>
visitor-eng.inw.jp@rxglobal.com
The numbers of exhibitors/countries (including co-exhibitors) and visitors (including concurrent shows) on this website are forecasts. These numbers may differ from the actual numbers at the show.
