TOP > About > Exhibit Profile / Area > IC & SENSOR PACKAGING TECHNOLOGY EXPO
Dates: January 19 (Wed) - 21 (Fri), 2022
Venue: Tokyo Big Sight, Japan
Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services
If you have queries, please do not hesitate to contact us.
Organiser: Reed Exhibitions Japan Ltd.
NEPCON JAPAN Show Management
TEL : +81-3-3349-8502
FAX : +81-3-3349-4900
E-mail :
For Exhibiting>>
inw@reedexpo.co.jp
For Visiting>>
visitor-eng.inw@reedexpo.co.jp
The numbers of exhibitors/countries (including co-exhibitors) and visitors (including concurrent shows) on this website are forecasts. These numbers may differ from the actual numbers at the show.
