Dates: January 19 (Wed) - 21 (Fri), 2022
Venue: Tokyo Big Sight, Japan

TOP > About > Exhibit Profile / Area > IC & SENSOR PACKAGING TECHNOLOGY EXPO

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services

Members of Conference Committee

The session program of the Technical Conference is planned by the following industry-leading experts.
(As of Oct. 19th, 2021 [Honorifics omitted])

< IC & SENSOR PACKAGING TECHNOLOGY EXPO >

If you have queries, please do not hesitate to contact us.

Organiser: RX Japan Ltd.
                          (Formerly Reed Exhibitions Japan Ltd.)
NEPCON JAPAN Show Management

TEL : +81-3-3349-8502
FAX : +81-3-3349-4900
E-mail :
For Exhibiting>>
inw.jp@rxglobal.com
For Visiting>>
visitor-eng.inw.jp@rxglobal.com