The session program of the Technical Conference is planned by the following industry-leading experts.
(As of Apr. 30, 2025 [Honorifics omitted])
Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services
Members of Conference Committee
< IC & SENSOR PACKAGING EXPO >
If you have queries, please do not hesitate to contact us.
Organiser: RX Japan Ltd.
NEPCON JAPAN Show Management
TEL : +81-3-6739-4102
E-mail : For Exhibiting>>[email protected] / For Visiting>> [email protected]
The numbers of exhibitors/countries (including co-exhibitors) and visitors (including concurrent shows) on this website are forecasts. These numbers may differ from the actual numbers at the show.