Members of Conference Committee

The session program of the Technical Conference is planned by the following industry-leading experts.

< IC & Sensor Packaging Technology EXPO >

Shoji Uegaki
Senior Director,
Business Development/
Technical Support Dept.,
ASE Group

Akio Katsumata
Development Engineering Officer,
Vice President,
J-Devices Corp.

Naohiko Hirano
Director, 
Sensor Engineering Div.,
DENSO Corp.

Chiaki Takubo
Senior Fellow, Discrete Semiconductor Div.,
Toshiba Electronic Devices & Storage Corp.

Osamu Nogimura
President,
Renesas Semiconductor Package & Test Solutions Co., Ltd.

Tsutomu Sekiya
General Manager, Tokyo Sales Branch, Sales Div.,
C. Uyemura & Co., Ltd.

Hidenori Onodera
Representative Director,
Kulicke and Soffa (Japan), Ltd.

Sumitoshi Asakuma
Director & Senior Managing Executive Officer,
Sumitomo Bakelite Co., Ltd.

Souichiro Kishimoto
Senior Executive Officer,
Global Sales & Marketing Div. Head,
Dexerials Corp.

Chuichi Miyazaki
Chief Technical Director,
Packaging Solution Center,
Packaging Materials Business Sector,
Advanced Performance Materials Business Headquarters,
Hitachi Chemical Co., Ltd.

< PWB EXPO >

Hiroshi Kondo
Principal Engineer,
Jisso Technology Development Div.,
Processing Process Development Center,
Production Engineering Headquarters,
Canon Inc.

Hiroshi Iinaga
General Manager, DESIGN Dept.,
Oki Printed Circuits Co., Ltd.

Koji Ikawa
Chief Engineer, Research Engineer, Production Technology Div.,
CMK Corp.

Hirofumi Matsumoto
Fellow/Senior Advisor,
Nippon Mektron, Ltd.

Kiyotaka Komori
Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co., 
Panasonic Corp.

Takayuki Suzuki
Manager/PWB Materials,
PWB Materials Business Sector,
Advanced Performance Materials Business Headquarters,
Hitachi Chemical Co., Ltd.

Mitsuaki Toda
Executive Officer, General Manager, Product Development Dept.,
Meiko Electronics Co., Ltd.

(As of Oct.1, 2018 [Honorifics omitted])