• 20 - 22 January, 2021
  • Tokyo Big Sight, Japan

Members of Conference Committee

The session program of the Technical Conference is planned by the following industry-leading experts.

< IC & Sensor Packaging Technology EXPO >

Shigeki Sako
Vice President,
Engineering Development,
Amkor Technology Japan, Inc.

Naohiko Hirano
Head of Business Unit, 
Sensor Business Unit,
DENSO Corp.

Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.

Keiichiro Kata
Distinguished Engineer,
Production and Technology
Unit, Acting Corporate
Strategy & Finance Div.,
Renesas Electronics Corp.

Tsutomu Sekiya
Director, General Manager, Tokyo Sales Branch, Sales Div.,
C. Uyemura & Co., Ltd.

Sumitoshi Asakuma
Director & Senior Managing Executive Officer,
Sumitomo Bakelite Co., Ltd.

Chuichi Miyazaki
Chief Technical Director,
Packaging Solution Center,
Information and Communication
Business Headquarters,
Hitachi Chemical Co., Ltd.

< PWB EXPO >

Hiroshi Kondo
Principal Engineer,
Jisso Technology Development Div.,
Processing Process Development Center,
Production Engineering Headquarters,
Canon Inc.

Hiroshi Iinaga
General Manager, DESIGN Dept.,
Oki Printed Circuits Co., Ltd.

Koji Ikawa
Chief Engineer, Research Engineer, Technical Development Div.,
CMK Corp.

Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.

Kiyotaka Komori
Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., 
Industrial Solutions Co.,
Panasonic Corp.

Takayuki Suzuki
Manager/PWB Materials,
PWB Materials Business Sector,
Advanced Performance Materials Business Headquarters,
Hitachi Chemical Co., Ltd.

Mitsuaki Toda
Executive Officer, General Manager,
Product Planning and
Development Dept.,
Engineering Headquarters,
Meiko Electronics Co., Ltd.

(As of June 26th, 2020 [Honorifics omitted])