Members of Conference Committee

The session program of the Technical Conference was planned by the following industry-leading experts.

< IC & SENSOR PACKAGING TECHNOLOGY EXPO >

Shigeki Sako
Vice President,
R&D,
Amkor Technology Japan, Inc.

Tsutomu Sekiya
Director, General Manager, 
Tokyo Sales Branch, Sales Div.,
C. Uyemura & Co., Ltd.

Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.

Chuichi Miyazaki
General Manager,
Packaging Solution Center,
Information and Communication
R&D Center,
Information and Communication Business Headquarters,
Showa Denko Materials Co., Ltd.

Sumitoshi Asakuma
Director & Senior Managing Executive Officer,
Sumitomo Bakelite Co., Ltd.

Takashi Matsumoto
Director, ASIC Engineering Div.,
DENSO Corp.

Keiichiro Kata
Distinguished Engineer,
Production and Technology Unit,
Acting Corporate Strategy
& Finance Div.,
Renesas Electronics Corp.

< PWB EXPO >

Hiroshi Iinaga
General Manager, Design Dept.,
OKI Circuit Technology Co., Ltd.

Masaki Yamaguchi
Senior Researcher,
Laminate Materials R&D Dept.,
Information and Communication
R&D Center, Information and
Communication Business Headquarters,
Showa Denko Materials Co., Ltd.

Koji Ikawa
Chief Engineer
(Qualified as 1st Grade of PWB Design Engineer),
Research Engineer,
Technical Development Div.,
CMK Corp.

Kiyotaka Komori
Assistant General Manager,
Yokkaichi Circuit Board Material Dept.,
Plastic Materials Business Unit,
Electronic Materials Business Div.,
Industry Co.,
Panasonic Corp.

Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.

Mitsuaki Toda
Executive Officer, General Manager,
Product Planning and
Development Dept.,
Engineering Headquarters,
Meiko Electronics Co., Ltd.

(As of October 19th, 2021 [Honorifics omitted])