Takeshi Kato
Regional Segment Head,
Industrial & Infrastructure Segment Japan,
Infineon Technologies Japan K.K.

Natsuki Nozawa
Senior Director,
Head of Business Unit,
Electric Power Conversion Business Unit
DENSO Corp.

Noriyasu Kurihara
Director, Vice President
Vice President 
Semiconductor Div.
Toshiba Electronic Devices & Storage Corp.

Toru Hosen
Senior Managing Executive Officer and Director
Corporate General Manager, Semiconductors Business Group,
Fuji Electric Co., Ltd. 

Masayoshi Takemi
Executive Officer,
Group President, Semiconductor ＆ Device,
Mitsubishi Electric Co.

Kozo Ide
Senior Executive Officer,
General Manager,
Drives Div.
Yaskawa Electric Corp.

Kazuhide Ino
Member of the Board, Managing Executive Officer
ROHM Co., Ltd.

Shinji Baba
Vice President, R&D Center,
Amkor Technology Japan, Inc.

Hisamitsu Yamamoto
General Manager,
Central Reasearch Lab.,
C.Uyemura & Co., Ltd. 

Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.

Hironari Mori
General Manager,
Information & Telecommunication 
Materials Research Lab.,
SUMITOMO BAKELITE Co., Ltd.

Takashi Matsumoto
Director, ASIC Engineering Div.,
DENSO Corp.

Katsuhiko Suzuki
Head of Part,
Advanced Package Lab.,
Samsung Device Solutions R&D Japan,
Samsung Japan Corp.

Kosuke Azuma
Vice President,
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.

Hiroshi Iinaga
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.

Yuki Hirokawa
Manager,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.

Mitsuaki Toda
Office Manager
Co-Design and Development Office
MEIKO ELECTRONICS CO., LTD.