The session program of the Technical Conference was planned by the following industry-leading experts.
Members of Conference Committee
< IC & SENSOR PACKAGING EXPO >
Shigeki Sako
Vice President,
R&D,
Amkor Technology Japan, Inc.
Hisamitsu Yamamoto
General Manager,
Technical Development Dept.
B, Central Research Lab.,
Research and Development Div.,
C. Uyemura & Co., Ltd.
Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.
Ken Ukawa
General Manager,
Information & Telecommunication
Materials Research Lab.,
Sumitomo Bakelite Co., Ltd.
Takashi Matsumoto
Director, ASIC Engineering Div.,
DENSO Corp.
Kosuke Azuma
Vice President,
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.
Katsuhiko Suzuki
General Manager,
Advanced Package Business Development Dept.,
Electronics Business Headquarters,
Resonac Corp.
< PWB EXPO >
Hiroshi Iinaga
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.
Koji Ikawa
Chief Engineer
(Qualified as 1st Grade of PWB Design Engineer),
Research Engineer,
Technical Development Div.,
CMK Corp.
Yuki Hirokawa
Manager,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.
Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.
Mitsuaki Toda
General Manager,
Technology Research and Analytics Office,
Meiko Electronics Co., Ltd.
Minoru Kakitani
Manager, Head of Elemental
Technology Development Team,
Laminate Materials R&D Dept.,
Electronics R&D Center, Electronics
Business Headquarters,
Resonac Corp.
(As of May 23th, 2023 [Honorifics omitted])