The session program of the Technical Conference was planned by the following industry-leading experts.
Members of Conference Committee
< Power Device & Module Expo >
President, Representative Director,
Infineon Technologies Japan K.K
Head of Business Unit
Electrification Components Business Unit,
Senior Managing Executive Officer
and Director Corporate General Manager,
Semiconductors Business Group,
Fuji Electric Co., Ltd.
Group President, Semiconductor ＆ Device,
Mitsubishi Electric Co.
Senior Executive Officer,
Yaskawa Electric Co.
< IC & SENSOR PACKAGING EXPO >
Technical Development Dept.
B, Central Research Lab.,
Research and Development Div.,
C. Uyemura & Co., Ltd.
Package and Test Technology,
Information & Telecommunication
Materials Research Lab.,
Sumitomo Bakelite Co., Ltd.
Director, ASIC Engineering Div.,
Head of Part,
Advanced Package Lab.,
Samsung Device Solutions R&D Japan,
Samsung Japan Corp.
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.
< PWB EXPO >
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.
(Qualified as 1st Grade of PWB Design Engineer),
Technical Development Div.,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.
FlexLink Technology Co., Ltd.
Technology Research and Analytics Office,
Meiko Electronics Co., Ltd.
Manager, Head of Elemental
Technology Development Team,
Laminate Materials R&D Dept.,
Electronics R&D Center, Electronics
(As of Nov. 17th, 2023 [Honorifics omitted])