The session program of the Technical Conference was planned by the following industry-leading experts.
Members of Conference Committee
< IC & SENSOR PACKAGING EXPO >
Shigeki Sako
Vice President,
R&D,
Amkor Technology Japan, Inc.
Tsutomu Sekiya
Director, General Manager,
Tokyo Sales Branch, Sales Div.,
C. Uyemura & Co., Ltd.
Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.
Katsuhiko Suzuki
General Manager,
Information and Communication
R&D Center,
Information and Communication
Business Headquarters,
Resonac Corp.
Shinichi Kajiya
Managing Executive Officer,
General Manager,
Information & Telecommunication Materials Div.,
Sumitomo Bakelite Co., Ltd.
Takashi Matsumoto
Director, ASIC Engineering Div.,
DENSO Corp.
Keiichiro Kata
Senior Principal Specialist,
Acting Production and Technology Unit, Packaging Technology Div.,
Outsourced Manufacturing Procurement Dept., Procurement Div.,
Renesas Electronics Corp.
< PWB EXPO >
Hiroshi Iinaga
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.
Masaki Yamaguchi
Senior Researcher,
Laminate Materials R&D Dept.,
Information and Communication
R&D Center, Information and
Communication Business Headquarters,
Resonac Corp.
Koji Ikawa
Chief Engineer
(Qualified as 1st Grade of PWB Design Engineer),
Research Engineer,
Technical Development Div.,
CMK Corp.
Yuki Hirokawa
Manager,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.
Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.
Mitsuaki Toda
General Manager,
Technology Research and
Analytics Office,
Electronics Assembly and
Interconnect Engineering Center,
Meiko Electronics Co., Ltd.
(As of Jan. 5th, 2023 [Honorifics omitted])