Members of Conference Committee

The session program of the Technical Conference was planned by the following industry-leading experts.

< Power Device & Module Expo >

Ikuya Kawasaki
President, Representative Director,
Infineon Technologies Japan K.K

Natsuki Nozawa
Head of Business Unit,
Electrification Components
Business Unit
Denso Co.

Toru Hosen
Senior Managing Executive Officer
and Director Corporate General Manager,
Semiconductors Business Group,
Fuji Electric Co., Ltd.

Masayoshi Takemi
Executive Officer,
Group President, Semiconductor & Device,
Mitsubishi Electric Co.

Kozo Ide
Executive Officer,
General Manager Drives Division
Yaskawa Electric Corp.


Hisamitsu Yamamoto
General Manager,
Technical Development Dept.
B, Central Research Lab.,
Research and Development Div.,
C. Uyemura & Co., Ltd.

Chiaki Takubo
Technology Executive,
Package and Test Technology,

Takeshi Mori
Executive Officer
Information & Telecommunication
Materials Research Laboratory
Information & Telecommunication Materials Div.
Sumitomo Bakelite Co., Ltd.

Takashi Matsumoto
Director, ASIC Engineering Div.,

Katsuhiko Suzuki
Head of Part,
Advanced Package Lab.,
Samsung Device Solutions R&D Japan,
Samsung Japan Corp.

Kosuke Azuma
Vice President,
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.


Hiroshi Iinaga
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.

Koji Ikawa
Chief Engineer
(Qualified as 1st Grade of PWB Design Engineer),
Research Engineer,
Technical Development Div.,
CMK Corp.

Yuki Hirokawa
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

Hirofumi Matsumoto
FlexLink Technology Co., Ltd.

Mitsuaki Toda
General Manager,
Technology Research and Analytics Office,
Meiko Electronics Co., Ltd.

Minoru Kakitani
Manager, Head of Elemental
Technology Development Team,
Laminate Materials R&D Dept.,
Electronics R&D Center, Electronics
Business Headquarters,
Resonac Corp.

(As of May 23th, 2024 [Honorifics omitted])