Ikuya Kawasaki
President, Representative Director,
Infineon Technologies Japan K.K

Naoki Matsuoka
Senior Director,
Head of Business Unit
Electrification Components Business Unit,
Denso Co.

Toru Hosen
Senior Managing Executive Officer
and Director Corporate General Manager,
Semiconductors Business Group,
Fuji Electric Co., Ltd.

Masayoshi Takemi
Executive Officer,
Group President, Semiconductor ＆ Device,
Mitsubishi Electric Co.

Tatsuya Yamada
Senior Executive Officer,
General Manager,
Drives Div.,
Yaskawa Electric Co.

Hisamitsu Yamamoto
General Manager,
Technical Development Dept.
B, Central Research Lab.,
Research and Development Div.,
C. Uyemura & Co., Ltd.

Chiaki Takubo
Technology Executive,
Package and Test Technology,
KIOXIA Corp.

Ken Ukawa
General Manager,
Information & Telecommunication
Materials Research Lab.,
Sumitomo Bakelite Co., Ltd.

Takashi Matsumoto
Director, ASIC Engineering Div.,
DENSO Corp.

Katsuhiko Suzuki
Head of Part,
Advanced Package Lab.,
Samsung Device Solutions R&D Japan,
Samsung Japan Corp.

Kosuke Azuma
Vice President,
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.

Hiroshi Iinaga
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.

Koji Ikawa
Chief Engineer
(Qualified as 1st Grade of PWB Design Engineer),
Research Engineer,
Technical Development Div.,
CMK Corp.

Yuki Hirokawa
Manager,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

Hirofumi Matsumoto
CEO,
FlexLink Technology Co., Ltd.