The session program of the Technical Conference was planned by the following industry-leading experts.
Members of Conference Committee
< IC & SENSOR PACKAGING EXPO >
Amkor Technology Japan, Inc.
Technical Development Dept.
B, Central Research Lab.,
Research and Development Div.,
C. Uyemura & Co., Ltd.
Package and Test Technology,
Information & Telecommunication
Materials Research Lab.,
Sumitomo Bakelite Co., Ltd.
Director, ASIC Engineering Div.,
Packaging Technology Div.,
Production and Technology Unit,
Renesas Electronics Corp.
Advanced Package Business Development Dept.,
Electronics Business Headquarters,
< PWB EXPO >
Center Manager, Design Center,
OKI Circuit Technology Co., Ltd.
(Qualified as 1st Grade of PWB Design Engineer),
Technical Development Div.,
Product Development Dept.,
Circuit Board Materials Business Unit.,
Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.
FlexLink Technology Co., Ltd.
Technology Research and Analytics Office,
Meiko Electronics Co., Ltd.
Manager, Head of Elemental
Technology Development Team,
Laminate Materials R&D Dept.,
Electronics R&D Center, Electronics
(As of May 23th, 2023 [Honorifics omitted])