Power Device ＆ Module Technology Forum
Venue: East Hall 6
Pre-registration for these sessions are not required, but to enter the show venue, visitor badge is required.
Jan. 24 (Wed) 11:00 - 11:30
INDIUM CORPORATION
Trends in EV power electronics & the interconnect materials
Power electronics are the heart of every EV. This presentation will cover the technology and materials trends of it
Jan. 24 (Wed) 13:00 - 13:30
U-MAP CO., LTD.
Revolutionary Heat Solutions with Fibrous AlN Filler
Thermalnite(R), sustainable heat dissipation! Our incomparable unique technology and innovative materials pave the way.
Jan. 24 (Wed) 14:00 - 14:30
HENKEL JAPAN LTD.
High thermal conductivity dieattach material
Introduction of high thermal conductivity dieattach material for power semiconductors.
Jan. 24 (Wed) 15:00 - 15:30
BASIC SEMICONDUCTOR LTD.
Technical aproach to the SiC module in China market
The technical approach for our products into the expanded Chinese SiC market is introduced with our products lineup
Jan. 25 (Thur) 13:00 - 13:30
MACDERMID PERFORMANCE SOLUTIONS JAPAN K.K
Specialty Chemical&Material for Sustainable Semicon Industry
Jan. 25 (Thur) 14:00 - 14:30
INTEGRATED MICRO-ELECTRONICS INC.
Power Devices Packaging Technology Challenges and Prospects
Key issues identified for power device packaging and their impact on performance and reliability.
Jan. 25 (Thur) 15:00 - 15:30
MITSUBISHI ELECTRIC CO.
Mitsubishi Electric power devices' latest development trends
The latest development trends in chips and packages aimed at realizing GX will be introduced.
Jan. 26 (Fri) 11:00 - 11:30
SPECTRUM LOGIC LTD.
CMOS X-ray Technology for Non-Destructive Testing
The advantages of CMOS X-ray Technology for Non-Destructive Testing and Inspection of Electronics
Jan. 26 (Fri) 14:00 - 14:30
NIKKISO CO., LTD.
Introduction of 3D technology and development equipment
Visitor Badge is required to enter the show venue.
Register Now!
2 ways for your visitor registration. Choose one from below
Manager or above job Title